Non-volatile memory cell fabricated with slight modification to a conventional logic process and methods of operating same

Abstract

A non-volatile memory cell is fabricated using a conventional logic process, with minor modifications. The cell is fabricated by forming a shallow trench isolation (STI) region in a well region of a semiconductor substrate. A recessed region is formed in the STI region, wherein the recessed region extends into the STI region and exposes a sidewall region in the well region. A capacitor region is formed in the sidewall region. A dielectric layer is formed over the well region, including the sidewall region. A gate electrode is then formed over the dielectric layer, wherein a portion of the gate electrode extends into the recessed region. An access transistor of the cell is then formed in a self-aligned manner with respect to the gate electrode. A capacitor structure is formed by the gate electrode (in the recessed region), the dielectric layer on the sidewall region, and the capacitor region.