The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Jun. 24, 2003
Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics
Applicants:
Michael Friedemann, Dresden, DE;
Volker Kahlert, Dresden, DE;
Inventors:
Michael Friedemann, Dresden, DE;
Volker Kahlert, Dresden, DE;
Assignee:
Advanced Micro Devices, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 214763 ;
U.S. Cl.
CPC ...
Abstract
The adhesion properties of a metal interconnect structure are enhanced by selectively depositing a barrier layer component having good adhesion to an underlying metal on the bottom surface of a via. Then, a further barrier layer having superior adhesion characteristics for the dielectric is formed on the dielectric sidewalls of the via, so that excellent adhesion to the dielectric and the underlying metal is achieved. The selectivity of the deposition may be accomplished by exploiting the capabilities of modem IPVD tools.