The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Nov. 28, 2001
Applicants:
Rose A. Mulligan, Chandler, AZ (US);
Jun He, Portland, OR (US);
Thomas Marieb, Portland, OR (US);
Susanne Menezes, Portland, OR (US);
Steven Towle, Phoenix, AZ (US);
Inventors:
Rose A. Mulligan, Chandler, AZ (US);
Jun He, Portland, OR (US);
Thomas Marieb, Portland, OR (US);
Susanne Menezes, Portland, OR (US);
Steven Towle, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2100 ; H01L 2144 ;
U.S. Cl.
CPC ...
Abstract
A method of dicing a microelectronic device wafer comprising forming at least one trench in at least one dicing street on the microelectronic device wafer, wherein the trench prevents cracking and/or delamination problems in the interconnect layer of the microelectronic device wafers caused by a subsequent dicing by a wafer saw.