The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Jan. 29, 2003
Chen-Hua Yui, Hsin-Chu, TW;
Tsu Shih, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Abstract
A method for preventing peeling of a metal layer formed over a semiconductor wafer process surface during a chemical mechanical polishing (CMP) process including providing a semiconductor wafer having a process surface comprising a periphery portion and a central portion said central portion including active areas having semiconductor devices features formed therein the process surface including a dielectric insulating layer; forming a plurality of openings in the periphery portion to form closed communication with the dielectric insulating layer the plurality of openings having an aspect ratio of at least 2; blanket depositing a metal layer to cover the process surface including the periphery portion to include filling the plurality of openings to anchor the metal layer; and, performing a CMP process to remove at least a portion of the metal layer from the process surface.