The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Dec. 28, 2001
Applicant:
Inventors:
Assignee:
Ibiden Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/03 ;
Abstract
A metal layer is sandwiched between insulating layers and so that required strength is maintained. Hence it follows that the thickness of a core substrate can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings which reach the metal layer in the insulating layers and is simply required. Therefore, small non-penetrating openings can easily be formed by applying laser beams. Thus, through holes each having a small diameter can be formed.