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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6825617 B1

PDFFull Text
Expired
Date of Patent:
Nov. 30, 2004

Filed:

Feb. 27, 2003

Semiconductor processing apparatus

Applicant:
Inventors:

Seiichiro Kanno, Ibaraki, JP;

Ryoji Nishio, Kudamatsu, JP;

Ken Yoshioka, Hikari, JP;

Saburou Kanai, Hikari, JP;

Hideki Kihara, Kudamatsu, JP;

Hideyuki Yamamoto, Kudamatsu, JP;

Assignee:

Hitachi High-Technologies Corporation, Tokyo, JP;

Attorney:

Antonelli, Terry, Stout & Kraus, LLP

Primary Examiner:

Haissa Philogene

Int. Cl.
CPC ...
H01J 7/24 ;
U.S. Cl.
CPC ...
H01J 7/24 ;
Abstract

A semiconductor processing apparatus that processes a semiconductor wafer disposed in a process chamber of a processing apparatus main unit includes a setting unit for enabling a user to set a temperature of the semiconductor wafer and control unit for controlling a processing of the semiconductor wafer based on the temperature of the semiconductor wafer set by the setting unit.

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Kanno, Seiichiro. (2004). Semiconductor processing apparatus (U.S. Patent No. 6825617). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6825617

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