The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2004

Filed:

Oct. 27, 2000
Applicant:
Inventors:

Kathleen Hennessey, Richardson, TX (US);

Youling Lin, Richardson, TX (US);

Yongqiang Liu, Plano, TX (US);

Veera V. S. Khaja, Plano, TX (US);

Yonghang Fu, Plano, TX (US);

Assignee:

Rudolph Technologies, Inc., Flanders, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 ; G01N 2/100 ; H01L 2/166 ;
U.S. Cl.
CPC ...
G06K 9/00 ; G01N 2/100 ; H01L 2/166 ;
Abstract

A method of collating and using captured semiconductor-wafer image data in an automated defect analysis. The method includes the steps of receiving image data and, if necessary, converting it to a digital format. Once the data is in pixel-by-pixel form, each pixel is assigned a slope value derived from the direction of the structure edge, if any, on which it lies. The pixel-slope data is then evaluated to determine whether a photo-resist anomaly is present. The method may also include evaluated an average pixel slope value for each inspected wafer. Dependant claims further define the invention to claim an inspection system for employing the method.


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