The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Oct. 24, 2002
Michael Lane, Cortlandt Manor, NY (US);
Fenton Read McFeely, Ossining, NY (US);
Conal Murray, Yorktown Heights, NY (US);
Robert Rosenberg, Cortlandt Manor, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The barrier material of the invention provides for the electrodeposition of copper. The barrier layer includes a dielectric interface surface region, and a copper interface surface region with at least 50 atom percent of a copper interface metal. In particular, the barrier layer of the invention provides for the electrodeposition of copper or copper alloy directly onto the copper interface region of the barrier layer in a direct electrodeposition process. The process includes providing a dielectric layer disposed on an underlayer, contacting a barrier layer to the dielectric layer, and depositing a conducting layer onto the barrier layer.