The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2004
Filed:
Feb. 25, 2002
Applicant:
Inventors:
Ching Man Stanley Tsui, Kwai Chung, CN;
M. Bilan Curito, Jr., Kwai Chung, CN;
Lap Kei Eric Chow, Kwai Chung, CN;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/102 ; G01R 3/126 ;
U.S. Cl.
CPC ...
G01R 3/102 ; G01R 3/126 ;
Abstract
The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.
Tsui, Ching Man Stanley. (2004). Method and apparatus for processing an array of packaged semiconductor devices (U.S. Patent No. 6806725). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6806725
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile