The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2004

Filed:

Jul. 18, 2002
Applicant:
Inventors:

Masaki Munakata, Kanagawa, JP;

Hirohito Komatsu, Kanagawa, JP;

Satoshi Kumon, Kanagawa, JP;

Kazuma Teramoto, Aichi, JP;

Nobuhiro Goda, Aichi, JP;

Masakazu Motoi, Aichi, JP;

Noriyuki Saitou, Fukuoka, JP;

Toshiaki Sakakihara, Fukuoka, JP;

Makoto Ishikawa, Fukuoka, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract

A silver or silver alloy thin layer on a substrate is etched by an etching liquid uniformly without producing an etching residue while avoiding side etching due to over etching. The etching liquid contains silver ions in a range from 0.005 to 1 weight %. The etching liquid is fed to a tank or an etching liquid feeding apparatus, and then brought into contact with the silver or silver alloy thin layer on the substrate.


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