The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2004

Filed:

Oct. 05, 2001
Applicant:
Inventors:

Takashi Tanaka, Kanagawa, JP;

Takashi Tsuzuki, Tokyo, JP;

Fujihiko Toyomasu, Kanagawa, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/702 ; B24B 7/22 ;
U.S. Cl.
CPC ...
B24B 5/702 ; B24B 7/22 ;
Abstract

A method for feeding slurry, and a slurry feeder capable of feeding slurry to a chemical mechanical polishing apparatus, are disclosed. Slurry is fed from a slurry supply tank, that stores slurry at a given concentration, to chemical mechanical polishing apparatuses via slurry feed pumps. Operations of the slurry feed pumps are suspended during a period of time other than during a time of feeding slurry to the chemical mechanical polishing apparatuses. A slurry feeder for feeding a slurry to a polishing apparatus includes a pump for feeding slurry at a flow rate Q from a slurry supply tank to the polishing apparatus. When a given sedimentation velocity of slurry is indicated by V, a horizontal sectional area of the slurry supply tank is set to become smaller than Q/V.


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