The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2004

Filed:

Nov. 19, 2002
Applicant:
Inventors:

Mark S. Chang, Los Altos, CA (US);

Douglas J. Bonser, Austin, TX (US);

Marina V. Plat, San Jose, CA (US);

Chih Yuh Yang, San Jose, CA (US);

Scott A. Bell, San Jose, CA (US);

Srikanteswara Dakshina-Murthy, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1336 ; H01L 2/18234 ; H01L 2/1302 ; H01L 2/1461 ;
U.S. Cl.
CPC ...
H01L 2/1336 ; H01L 2/18234 ; H01L 2/1302 ; H01L 2/1461 ;
Abstract

A layer of material is patterned anisotropically using a bi-layer hardmask structure. Residual photoresist from a photoresist mask used to pattern an upper layer of the bi-layer hardmask is removed prior to patterning of the polysilicon layer. Passivation agents are later introduced from an external source during patterning of the layer of material. This provides a substantially uniform supply of passivation agents to all parts of the layer of material as it is being etched, rather than relying on the generation of passivation agents from consumption of photoresist during etching, which can produce local non-uniformities of passivation agent availability owing to differences in photoresist thickness remaining on different sized features.


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