The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Jul. 12, 2002
Applicant:
Inventors:
Qing-Tang Jiang, Austin, TX (US);
Jiong-Ping Lu, Richardson, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10L 2/14763 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H10L 2/14763 ; H01L 2/144 ;
Abstract
The electroplating of copper is the leading technology for forming copper lines on integrated circuits. In the copper electroplating process a negative potential is applied to the semiconductor wafer with the surface of the semiconductor wafer acting as the cathode. The anode will be partially or wholly formed with copper. Both the anode and the semiconductor will be exposed to a solution comprising copper electrolytes. By reducing the temperature of the copper electrolytes solution below 25° C. the rate of self annealing grain growth will increase reducing the final resistively of the copper lines.