The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2004

Filed:

Jun. 05, 2003
Applicant:
Inventors:

Joachim Nuetzel, Kulmback, DE;

Christian Arndt, Wappinger Falls, NY (US);

Greg Costrini, Hopewell Junction, NY (US);

Michael C. Gaidis, Wappinger Falls, NY (US);

Xian Jay Ning, Shanghai, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/128 ;
U.S. Cl.
CPC ...
H01L 2/128 ;
Abstract

A method for forming interconnect structures in a magnetic random access memory (MRAM) device includes defining an array of magnetic tunnel junction (MTJ) stacks over a lower metallization level. A encapsulating dielectric layer is formed over the array of MTJ stacks and the lower metallization level. Then, a via opening is defined in the encapsulating dielectric layer, and a planar interlevel dielectric (ILD) layer is deposited over the encapsulating dielectric layer and within the via opening. Openings are then formed within ILD layer, over the array of MTJ stacks and the via opening.


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