The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Jul. 24, 2001
Applicant:
Inventors:
Kan Yasui, Kodaira, JP;
Souichi Katagiri, Kodaira, JP;
Masayuki Nagasawa, Kawagoe, JP;
Ui Yamaguchi, Urawa, JP;
Yoshio Kawamura, Kokubunji, JP;
Assignee:
Renesas Technology Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ; C09K 1/300 ; C09K 1/306 ;
U.S. Cl.
CPC ...
H01L 2/1302 ; C09K 1/300 ; C09K 1/306 ;
Abstract
In a production process of a semiconductor device, planarizing of a wafer surface pattern can be performed to attain high planarity, good uniformity in the removal amount and improved controllability. This process include a step of planarizing a semiconductor wafer, from which at least two different films have been exposed, by polishing with a grindstone and a dispersant-containing processing liquid.