The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Jan. 13, 2001
Ying-Chou Tsai, Hsinchu, TW;
Jen-Yi Tsai, Chiayi, TW;
Siliconware Precision Industries Co., Ltd., Taiwan, TW;
Abstract
A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the substrate to allow the portion of the solder mask formed over a vent hole in the substrate to be substantially raised to an elevated flat surface where a groove is then formed to surround the exit of the vent hole. During a molding process, when the encapsulation material infiltrates to the exit of the vent hole, it can be confined within the groove in the elevated flat surface over the dummy pad, thereby preventing it from flashing to nearby solder-ball pads. Since there would substantially exist no mold flash over the exposed surface of the solder mask and the solder-ball pads, the proposed method allows the resulting FCBGA package to be assured in the quality of its outer appearance and the quality of the electrical bonding between the solder-ball pads and the subsequently attached solder balls thereon to make the encapsulated semiconductor chip reliable to use during operation.