The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Aug. 13, 2002
Toshiaki Mugibayashi, Tokyo, JP;
Nobuyoshi Hattori, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A computer-implemented method of process analysis allows for accurate analysis of the degree of achievement of a predetermined effect exhibited by a predetermined process included in a manufacturing operation. In a step S , a first manufacturing operation including a predetermined cleaning process is performed to form chips on wafers to be cleaned. In a step S , a second manufacturing operation including details identical to those of the first manufacturing operation except the predetermined cleaning process is performed to form chips on wafers not to be cleaned. In a step S , an electric tester is applied to all the chips formed on the wafers to be cleaned and the wafers not to be cleaned, to determine the quality of each chip. In a step S , all the chips are classified into four categories according to the kind of wafer (i.e., the wafer to be cleaned or the wafer not to be cleaned) and the quality as determined of each chip. Then, in a step S , the effect of improving the quality of a chip achieved by the predetermined cleaning process is analyzed using the classification performed in the step S as “chip classification data”.