The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6761812 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 13, 2004

Filed:

Nov. 25, 2002
Applicant:
Inventors:

Axel Preusse, Radebeul, DE;

Gerd Marxsen, Radebeul, DE;

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 2/112 ; C25D 5/00 ;
U.S. Cl.
CPC ...
C25D 2/112 ; C25D 5/00 ;
Abstract

In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative of the current flow in each contact portion may be determined. Moreover, for precise control of the currents, means are provided for monitoring the currents.


Find Patent Forward Citations

Preusse, Axel. (2004). Apparatus and method for electrochemical metal deposition (U.S. Patent No. 6761812). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6761812

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…