The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Feb. 27, 2002
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A system and method of manufacturing wafers are provided suitable for a semiconductor manufacturing system and a method thereof capable of shortening the processing period composed of a series of processes applied to objects to be processed, mainly carry out processes and conveyance peace by peace, and which can manufacture even various kings of products. The system is provided with a plurality of processing units each having therein a conveying mechanism, and is provided therein with a conveyer device for conveying the objects to be processed to the processing units. Further, the conveyer device includes loader conveying means which is laid along object transferring ports of the plurality of processing units across the object transferring ports of not less than two of the processing units, and a running robot which runs across not less than two of the object transferring ports, and a transferring robot for transferring the objects to be processed from the running robot to the processing units through the transferring ports, are arranged in the loader means. The loader means is shielded and provided with a purifying device so as to define an atmospheric pressure space conveying path.