Lithography system and method for device manufacture

Abstract

A lithography system and method for cost-effective device manufacture that can employ a continuous lithography mode of operation is disclosed, wherein exposure fields are formed with single pulses of radiation. The system includes a pulsed radiation source ( ), an illumination system ( ), a mask (M), a projection lens ( ) and a workpiece stage ( ) that supports a workpiece (W) having an image-bearing surface (WS). A radiation source controller ( ) and a workpiece stage position system ( ), which includes a metrology device ( ), are used to coordinate and control the exposure of the mask with radiation pulses so that adjacent radiation pulses form adjacent exposure fields (EF). Where pulse-to-pulse uniformity from the radiation source is lacking, a pulse stabilization system ( ) may be optionally used to attain the desired pulse-to-pulse uniformity in exposure dose. The rapidity at which exposures can be made using a single radiation pulse allows for a very high throughput, which in turn allows for a small-image-field projection lens to be utilized in a cost-effective manner in the manufacture of devices such as semiconductor integrated circuits and the like. The system can also be used in the conventional “step-and-repeat” mode of operation, so that the system owner can decide the most cost-effective mode of operation for any given application.