The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2004

Filed:

Jul. 26, 2001
Applicant:
Inventors:

Yoshihiro Kurii, Amagasaki, JP;

Etsuji Kameda, Amagasaki, JP;

Sachiko Nakamura, Amagasaki, JP;

Assignee:

Mec Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 1/300 ; C09K 1/304 ; C09K 1/306 ; H01L 2/1302 ;
U.S. Cl.
CPC ...
C09K 1/300 ; C09K 1/304 ; C09K 1/306 ; H01L 2/1302 ;
Abstract

A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.


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