The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Sep. 14, 1999
Applicant:
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ; H01L 2/976 ; H01L 2/711 ;
U.S. Cl.
CPC ...
H01L 2/900 ; H01L 2/976 ; H01L 2/711 ;
Abstract
A semiconductor device including a well divided into a plurality of parts by a trench, to effect a reduction in layout area, and a manufacturing method thereof. In the semiconductor device, an element isolation film is formed such as to have to a depth from the main surface of a semiconductor substrate, and the area from the main surface of the substrate to the depth is divided into a plurality of first regions. A first well is formed in each of the first regions. A second well is formed in a second region deeper than the first well in the substrate, and the second well is in contact with some of the first wells.