Needle comb reticle pattern for critical dimension and registration measurements using a registration tool and methods for using same

Abstract

Needle comb reticle patterns for use in both critical dimension analysis and registration analysis with a registration tool are disclosed. One embodiment of a needle comb reticle pattern includes a box-in-box feature flanked on two adjacent sides by needle combs with tapered flat-tipped needles. Another embodiment of a needle comb reticle pattern includes a box-in-box feature flanked on two adjacent sides by needle combs with tapered flat-tipped needles and flanked on the other two adjacent sides by reference bars. Yet another embodiment of a needle comb reticle pattern includes two complementary needle comb reticle subpatterns, each subpattern including a box-in-box feature with four flanking needle combs. A registration tool can be used with the needle combs and reference bars to measure critical dimension of a semiconductor process. The registration tool can also be used with the box-in-box feature to measure registration between two adjacent layers during semiconductor fabrication. Reticles, fields within reticles, masks and wafers including the needle comb reticle pattern of the present invention are also disclosed. Additionally, methods for analyzing critical dimension and registration and characterizing needle comb reticle measurements to critical dimension using the needle comb reticle patterns of the present invention are also disclosed.