The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Dec. 05, 2002
Chung-Che Tsai, Hsinchu, TW;
Ultra Tera Corporation, , TW;
Abstract
A stacked multi-chip semiconductor package and a fabrication method thereof are provided. A chip carrier is formed with an opening for receiving a first chip therein, and a second chip is stacked on the first chip and over the opening, wherein the first and second chips are respectively electrically connected to the chip carrier by bonding wires. A first encapsulant is formed to encapsulate first chip and corresponding bonding wires, and a second encapsulant is formed around the second chip to encompass a cavity for receiving the second chip and corresponding bonding wires therein. A lid is attached to the second encapsulant for covering the cavity. This semiconductor package allows high integration and increase in operational performances by virtue of stacked multi-chip structure.