The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2004

Filed:

Nov. 08, 2001
Applicant:
Inventors:

Shinobu Kokufu, Osaka, JP;

Takeshi Suzuki, Osaka, JP;

Fumio Echigo, Osaka, JP;

Daizo Andoh, Osaka, JP;

Tatsuo Ogawa, Atlanta, GA (US);

Yoshihiro Kawakita, Osaka, JP;

Satoru Tomekawa, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/204 ; H01R 1/11 ;
U.S. Cl.
CPC ...
H05K 1/204 ; H01R 1/11 ;
Abstract

A protective agent for protecting a wiring is dispersed and placed in mottle-like on an interface between a via and a wiring layer . Then, each dimension of interface regions where the protective agent does not exist is set to such a size that a plurality of conductive powders constituting the via can abutted on the wiring layer . Therefore, the plurality of conductive powders and the wiring layer are abutted each other in each interface region where the protective agent does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.


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