The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Sep. 10, 2001
Chi-Ming Chang, Taiwan, TW;
Hsiao-Loung Lu, Taiwan, TW;
Chun-Che Tsao, Taiwan, TW;
Cheng-Li Chao, Taiwan, TW;
Chung-Chi Su, Taiwan, TW;
Nan Ya Plastics Corporation, Taipei, TW;
Abstract
Provided is a novel photosensitive resistive ink composition, comprising: (A) a photo curable prepolymer containing at least two ethylenically unsaturated bonds with an a,&bgr;-unsaturated carboxylic acid, represented by the formula I, (B) a photocurable monomer containing at least three vinyl groups and an a,&bgr;-unsaturated carboxylic acid, (C) a photo-initiator, (D) organic solvents, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit, (F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction, and (G) a clay nano-composite capable of increasing the surface area of inorganic materials of the photosensitive resistive ink composition. The composition produces a solder mask film having a desired pattern after coating, exposure, development and postcuring and excellent in adhesiveness, resistance to chemicals, resistance to insulatiion, resistance to heat, developability, pot life, resistance to electroless gold plating, transparency of the photo-resist film and resolution.