The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2004

Filed:

Feb. 04, 2002
Applicant:
Inventors:

Robert J. Falster, London, GB;

Martin Jeffrey Binns, St. Charles, MO (US);

Harold W. Korb, Town & Country, MO (US);

Assignee:

MEMC Electronics Materials, Inc., St. Peters, MO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1322 ;
U.S. Cl.
CPC ...
H01L 2/1322 ;
Abstract

A process for heat-treating a single crystal silicon wafer to dissolve agglomerated vacancy defects and to influence the precipitation behavior of oxygen in the wafer in a subsequent thermal processing step. The process includes subjecting the wafer to a heat treatment to dissolve agglomerated vacancy defects, rapid thermally annealing the heat-treated wafer to cause the formation of crystal lattice vacancies throughout the wafer and controlling the cooling rate of the annealed wafer to allow some, but not all, of the crystal lattice vacancies to diffuse to the front surface to produce a wafer having a nonuniform vacancy concentration with the concentration of vacancies in the bulk of the wafer being greater than the concentration in the surface layer.


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