The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Nov. 17, 2000
Chien-Hsin Lai, Kaohsiung, TW;
Jung-Nan Tseng, Chu-Pei, TW;
Huang-Yi Lin, Tai-Ping, TW;
Kevin Yu, Hsin-Chu, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A pressure monitoring system arranged in a close loop circuit, intended to facilitate chemical mechanical polishing (CMP), is disclosed. The pressure monitoring circuit includes an air regulator, a pressure transducer, a pressure difference transducer and a pressure difference regulator. This hardware is equipped to facilitate finding three control parameters of the monitoring system—polishing pressure (P ), pressure difference of the polishing pressure and a corresponding wafer pressure (D ), and deviation of the output pressure difference from a set point pressure difference (C ). By monitoring P , D and C , air streams in a CMP process can be effectively regulated on a real time basis and the troubleshooting procedure for the system hardware can be practically reduced.