The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Jan. 14, 2002
Chi-Yao Wang, Jubei, TW;
Ming-Shuo Yen, Hsin-chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, JP;
Abstract
A semiconductor calibration wafer that has no charge effect is disclosed. The calibration wafer has a substrate layer and a conductive metal layer. The conductive metal layer completely covers the substrate layer, and has a critical dimension (CD) bar corresponding to a desired CD. The substrate layer may be an oxide layer or another type of substrate layer, whereas the conductive metal layer may be an aluminum layer, a copper layer, or another type of conductive metal layer. Where the calibration wafer is used in conjunction with a scanning electron microscope (SEM) to monitor the CD, the electrons ejected by the SEM do not remain on the semiconductor calibration wafer, but instead are carried away via the conductive metal layer. The calibration wafer is thus not vulnerable to the charge effect.