The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Feb. 21, 2003
Chee-Yee Chung, Chandler, AZ (US);
David G. Figueroa, Mesa, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic circuit package includes a vertical package section ( , FIG. ) electrically connected to a horizontal package section ( , FIG. ). The vertical package section includes multiple conductive layers ( , FIG. ) oriented in parallel with a vertical plane. A first set of bond pads ( , FIG. ) on the vertical section's horizontal top surface ( , FIG. ) can be connected to the bond pads ( , FIG. ) of an integrated circuit ( , FIG. ). A second set of bond pads ( , FIG. ) on the vertical section's horizontal bottom surface ( , FIG. ) can be connected to bond pads ( , FIG. ) on the horizontal package section. The conductive layers of the vertical section perform a bond pad pitch conversion in a first direction, and conductive structures ( , FIG. ) within the horizontal package section perform a bond pad pitch conversion in a second direction.