The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Aug. 15, 2001
Applicant:
Inventors:
Shu Chuen Ho, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Si Liang Lu, Singapore, SG;
Srikanth Narasimulau, Singapore, SG;
Charles J. Vath, III, Singapore, SG;
Assignee:
ASM Technology Singapore PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/304 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/304 ; H01L 2/302 ;
Abstract
A mold ( ) for a semiconductor chip ( ) has two mold halves ( ). One mold half ( ) includes sealing means ( ) adapted to exert a sealing pressure between a surface of the mold and a surface ( ) of a substrate ( ) located in the mold ( ) during a molding operation.