The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Feb. 20, 2002
Applicant:
Inventors:

David Lee, Hsinchu, TW;

Chewnpu Jou, Hsinchu Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18238 ;
U.S. Cl.
CPC ...
H01L 2/18238 ;
Abstract

A method of fabricating a MOS capacitor in a complementary MOS fabrication process with dual-doped poly gates comprises providing a substrate of a first conductive type, the substrate having a first well of the first conductive type and a second well of a second conductive type. A dielectric layer is formed on the substrate. A first poly gate of the first conductive type is formed on the dielectric layer over the first well and a second poly gate of the second conductive type is formed on the dielectric layer over the second well. A first doped region of the first conductive type is formed in the substrate at each side of the first poly gate. A second doped region of the second conductive type is formed in the substrate at each side of the second poly gate layer. A spacer is formed on sidewalls of the first poly gate and the second poly gate, wherein a portion of the dielectric layer is also removed to expose a portion of the first doped region and a portion of the second doped region. An implantation is performed on the exposed portion of the first doped region with dopants of the first conductive type, so as to form a first substrate electrode. An implantation process is performed on the exposed portion of the second doped region with dopants of the second conductive type to form a second substrate electrode.


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