The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Dec. 21, 2001
Applicant:
Inventors:

Geoffrey Wen-Tai Shuy, Taipei, TW;

Jong-Hong Lu, Taipei, TW;

Sheng-Ju Liao, Hsin-Chu, TW;

Huai-Luh Chang, Chung-Ho, TW;

Song-Wein Hong, Chang-Hua Hsien, TW;

Ruey-Cheng Huang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; B05D 1/36 ;
U.S. Cl.
CPC ...
B05D 5/12 ; B05D 1/36 ;
Abstract

This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate consists of a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate provides structural strength and surface-mount capability. The buffer layer provides the adhesion between the substrate and the nanostructure layer. The nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhances adhesion for metallization and electronic materials.


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