The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2003

Filed:

Apr. 12, 2000
Applicant:
Inventors:

Horng-Wen Chen, Taichung, TW;

Jeng-Fieng Lu, Hsin-chu, TW;

Chiang-Jen Peng, Hsin chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 2/100 ;
U.S. Cl.
CPC ...
G01N 2/100 ;
Abstract

A method for determining the number of contaminating particles in a process chamber is described. While the method is particularly suited for detecting particles in a metal etch chamber, the present invention novel method can be utilized in any other semiconductor process chambers as long as there is a particle contamination problem. The method is carried out by conducting at least two particle dislodging cycles each including a step of flowing at least one process gas used in the process into the chamber at a flow rate of at least 30 sccm, and then evacuating the at least one process gas from the chamber to a pressure of not higher than 1 mTorr. Typical process gas that can be utilized in a metal etch chamber includes Cl , BCl and Ar. The process gas should be flown into the etch chamber until a chamber pressure of at least 6 mTorr is reached, and preferably until at least a chamber pressure of 8 mTorr is reached. After the particle dislodging cycles are conducted, the number of particles that have fallen onto a top surface of the substrate can be counted by a particle counter.


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