The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Apr. 01, 1999
Tokyo Electron Limited, , JP;
Abstract
A processing apparatus and a processing method are capable of properly and easily obtaining accurate data on the contact pressure applied by an end effector to a workpiece while a process is being carried out. A processing apparatus ( ) processes a surface of a wafer (W) held by a spin chuck ( ) (holding means) by bringing an end effector ( ) into contact with the surface of the wafer (W). The end effector ( ) can be retracted from the surface of the wafer (W) to a waiting position ( ). A measuring and cleaning device ( ) comprises, in combination, a measuring device ( ) for measuring contact pressure to be applied to the wafer (W) by the end effector ( ), and a cleaning device ( ) for cleaning the end effector ( ). The measuring device ( ) has a table ( ) for supporting the end effector ( ), and a pressure sensor ( ) for measuring a pressure applied to the table ( ) to estimate a contact pressure actually applied by the end effector ( ) to the wafer (W). The support surface of the table ( ) and the surface of the wafer (W) held by the spin chuck ( ) are on the same level.