The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Sep. 11, 2000
Applicant:
Inventor:
Yasuharu Ariga, Nishishirakawa-gun, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 4/914 ; B28D 1/08 ;
U.S. Cl.
CPC ...
B24B 4/914 ; B28D 1/08 ;
Abstract
There is provided a cutting method comprising winding a wire around plural grooved rollers, and pressing the wire against the work with running it, to cut the work, wherein the work is cut with controlling temperature of the work by supplying a cutting fluid containing abrasive grains to the grooved rollers, and supplying a temperature controlling medium to the work and a wire saw. Thereby, influence of the heat generated during cutting process of the work is controlled, and a relative shift of the work and the wire can be suppressed, a level of a warp of a wafer and a local warp can be improved, and flatness in a polishing step can be improved.