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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6650408 B1

PDFFull Text
Date of Patent:
Nov. 18, 2003

Filed:

Nov. 20, 2001

Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus

Applicant:
Inventors:

Chung-Sam Jun, Whasung-gun, KR;

Kye-Weon Kim, Suwon-si, KR;

Yu-Sin Yang, Yongin-si, KR;

Hyo-Hoo Kim, Anyang-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon, KR;

Attorney:

Volentine Francos, PLLC

Primary Examiner:

Frank G Font

Assistant Examiner:

Sang H Nguyen

Int. Cl.
CPC ...
G01N 2/100 ;
U.S. Cl.
CPC ...
G01N 2/100 ;
Abstract

A method for inspecting a polishing pad, an apparatus for performing the method, and a polishing device adopting the apparatus for preventing wafer defects. Polishing pad defects are detected by comparing optical data from a normal polishing pad, which does not cause wafer defects, with optical data from a polishing pad to be inspected. The respective optical data are obtained by radiating a beam into the polishing pad and then collecting and analyzing a beam reflected from the polishing pad.

Find Patent Forward Citations

Jun, Chung-Sam. (2003). Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus (U.S. Patent No. 6650408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6650408

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