The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2003

Filed:

Dec. 14, 2000
Applicant:
Inventors:

Yuchun Wang, San Jose, CA (US);

Stan D. Tsai, Fremont, CA (US);

Kapila Wijekoon, Palo Alto, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Fred C. Redeker, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract

Ion exchange materials are employed in CMP methodologies to polish or thin a semiconductor substrate or a layer thereon. Embodiments include a polishing pad having an ion exchange material thereon and polishing a semiconductor substrate or a layer thereon with the polishing pad or a CMP composition including an ion exchange material therein and polishing the substrate or a layer thereon with the CMP composition or both.


Find Patent Forward Citations

Wang, Yuchun. (2003). Ion exchange materials for chemical mechanical polishing (U.S. Patent No. 6638143). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6638143

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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