The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2003

Filed:

Jan. 29, 2002
Applicant:
Inventors:

Fei Wang, San Jose, CA (US);

Lynne A. Okada, Sunnyvale, CA (US);

Ramkumar Subramanian, San Jose, CA (US);

James K. Kai, San Francisco, CA (US);

Calvin T. Gabriel, Cupertino, CA (US);

Lu You, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/100 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/100 ; H01L 2/148 ; H01L 2/150 ;
Abstract

A method for forming a metal interconnect structure in a semiconductor device with the elimination of via poisoning during trench mask formation employs a CVD organic BARC that isolates the low k dielectric film. The CVD organic BARC is deposited over the low k dielectric film and in the via hole. Once the trench mask has been formed on the CVD organic BARC, the CVD organic BARC may be removed in the same process as the photoresist of the trench mask layer. A properly formed trench will have been created since the via poisoning and resist scumming were substantially eliminated by the presence of the CVD organic BARC.


Find Patent Forward Citations

Loading…