The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2003

Filed:

Jul. 10, 2002
Applicant:
Inventors:

Yvonne Lee, Taichung, TW;

Chien-Ping Huang, Hsinchu, TW;

Han-Ping Pu, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

Conventional configuration of a lead frame, particularly a lead frame in a Lead-on-Chip package, is substituted by one having inward ends of leads thereof arranged in unprecedented ways, resulting in bigger gap between any two adjacent inward ends of inner leads, leading to bigger Inner Lead Pitch of a lead frame in which the space available is inherently limited. It is by the new configuration that an IC packaging process can be immunized against the difficulty resulting from too small Inner Lead Pitch of a lead frame, and the bottle neck in the process of packaging an IC subject to the tendency of minimizing the size of an IC can thus be overcome.


Find Patent Forward Citations

Lee, Yvonne. (2003). Lead frame adaptable to the trend of ic packaging (U.S. Patent No. 6621150). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6621150

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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