The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

Feb. 22, 2001
Applicant:
Inventors:

Haruhiko Asao, Chiyoda-ku, JP;

Yutaka Koshiba, Chiyoda-ku, JP;

Keiji Nogami, Chiyoda-ku, JP;

Tutomu Masui, Sakaishi, JP;

Kazumasa Hori, Sakaishi, JP;

Kenji Wakiguchi, Sakaishi, JP;

Masahiko Wada, Sakaishi, JP;

Yoshiaki Hattori, Sakaishi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/52 ;
U.S. Cl.
CPC ...
C21D 9/52 ;
Abstract

An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.


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