The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Jun. 17, 2002
Ming Wang Sze, Tsuen Wan, HK;
Kwok Cheung Tsang, Fanling, HK;
Wing Keung Lam, KLN, HK;
Kin-wai Wong, Chai Wan, HK;
Asat Ltd., New Territories, HK;
Abstract
An integrated circuit package including a flexible circuit tape having a flexible polyimide tape laminated to a conductor layer, a plurality of blind holes extending through the flexible tape to the conductor layer and a plurality of through holes extending through the flexible tape and the conductor layer. A copper leadframe is fixed to the flexible circuit tape and electrically isolated from the conductor layer. The copper leadframe includes an etched down die attach pad and heat spreader portions. The die attach pad is etched down such that at least a portion of the die attach pad is reduced in thickness. The through holes in the flexible circuit tape extend through to the copper leadframe. A semiconductor die is mounted on the at least a portion of the die attach pad. Wire bonds extend from pads on the semiconductor die to the die attach pad and from other pads on the semiconductor die to the conductor layer, an encapsulating material encapsulates the semiconductor die and the wire bonds. A plurality of solder ball contacts in the through holes are fixed to the copper leadframe and a plurality of solder ball contacts in the blind holes are fixed to the conductor layer.