The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Apr. 03, 2002
Chun Ho Fan, Sham Tseng, HK;
Tsui Yee Lin, Kowloon, HK;
Kin Yan Tsang, Kwai Fong, HK;
Neil McLellan, Hong Kong, HK;
ASAT Ltd., New Territories, HK;
Abstract
A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the thickness of the portion of the die attach pad. A plurality of wire bonds connect the die attach pad and the contact pads. An overmold covers the semiconductor die and all except one surface of the at least one row of contact pads and the die attach pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile