The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2003
Filed:
Dec. 04, 2000
Applicant:
Inventors:
Kazuo Sugiura, Akishima, JP;
Hirofumi Moroe, Musashimurayama, JP;
Fumihiko Kato, Fussa, JP;
Yasuyuki Komachi, Akishima, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 ; H05K 3/00 ;
U.S. Cl.
CPC ...
H01R 9/00 ; H05K 3/00 ;
Abstract
A method for forming pin-form wires or bumps on, for instance, an electrode pad of an electronic circuit element, in which a ball is formed on a tip end of a wire that passes through a capillary, the wire is then extended from the lower end of the capillary, a notch is formed in the portion of the wire between the ball and the capillary by a cutter, the ball is bonded to the electrode pad using the capillary, and the capillary is raised, thus pulling the wire and cutting the wire at the notch to form a pin-form wire or bump on the electrode pad.