The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
May. 31, 2001
Applicant:
Inventors:
Mark Thomas McCormack, Livermore, CA (US);
James Roman, Sunnyvale, CA (US);
Lei Zhang, San Jose, CA (US);
Solomon I. Beilin, San Carlos, CA (US);
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/300 ;
U.S. Cl.
CPC ...
H01B 1/300 ;
Abstract
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.
McCormack, Mark. (2003). Methods for fabricating flexible circuit structures (U.S. Patent No. 6572780). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6572780
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile