The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

Oct. 09, 2001
Applicant:
Inventors:

Dian-Hau Chen, Hsin-Chu, TW;

Ching-Tien Ma, Kaohsiung, TW;

Hsiang-Tan Lee, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/945 ;
U.S. Cl.
CPC ...
H01L 2/945 ;
Abstract

The use of an intermetal dielectric (IMD) layer and an organic etch-stop layer are disclosed in forming a dual damascene in order to reduce the RC delay and the overall dielectric constant of the damascene interconnect. The disclosed IMD layer is an FSG and the etch-stop layer is an organic spin-on-glass (SOG). A dual damascene structure utilizing the IMD layer and the organic etch-stop layer is also disclosed.


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