The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Jun. 12, 2002
Applicant:
Inventors:
Tzung-Han Lee, Taipei, TW;
Kun-Chi Lin, Hsin-Chu, TW;
Assignee:
United Microelectronics Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ;
Abstract
A multi-chip package which has a L-shaped plate and a plurality of dies arranged on the L-shaped plate. The L-shaped plate has a die package region, a plurality of solder bump pads disposed in the die package region, a plurality of pins electrically connected to a printed circuit board (PCB), and an internal circuit inside the L-shaped plate electrically connected to the plurality of solder bump pads and corresponding pins. Each die includes a plurality of bonding pads on an active surface of the die, and the bonding pads are electrically connected to corresponding solder bump pads.