The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Mar. 02, 2000
Applicant:
Inventors:
Kazuyuki Higashi, Yokohama, JP;
Noriaki Matsunaga, Chigasaki, JP;
Akihiro Kajita, Yokohama, JP;
Tamao Takase, Yokohama, JP;
Hisashi Kaneko, Fujisawa, JP;
Hideki Shibata, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/3544 ;
Abstract
The present invention is a method of producing a semiconductor device in which at least one alignment mark to be used in an exposure process of a lithographic process is formed of a wiring material which is copper or includes copper as a main component, and the alignment mark is formed entirely in an area outside an area where dicing is to be executed.
Higashi, Kazuyuki. (2003). Semiconductor device and producing method thereof (U.S. Patent No. 6555925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6555925
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile