The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2003

Filed:

Nov. 14, 2001
Applicant:
Inventors:

Yi Chuan Ding, Kaohsiung, TW;

Kun Ching Chen, Tainan, TW;

Yung I Yeh, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract

A substrate strip includes a plurality of substrate units wherein each of the substrate units is accepted for packaging a semiconductor package. The substrate strip comprises: a frame having at least one opening; at least one first substrate unit integrally formed with the strip frame; and at least one second substrate unit disposed in the opening and securely attached to the strip frame by an adhesive. The present invention further provides a method for making the substrate strip. The method is conducted by separating defected substrate units from a substrate strip and securely attaching accepted substrate units back to the substrate strip.


Find Patent Forward Citations

Ding, Yi. (2003). Substrate strip and manufacturing method thereof (U.S. Patent No. 6551855). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6551855

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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