The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2003

Filed:

Jul. 18, 2001
Applicant:
Inventors:

Yi-Li Hsiao, Chiai, TW;

Cheng-Chieh Hung, Hsinchu, TW;

Yu-Tsung Fu, Miao-Li, TW;

Weng-Liang Fang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 9/15 ;
U.S. Cl.
CPC ...
B25J 9/15 ;
Abstract

A wafer is carried on a blade supported on robotic arms. A plurality of guide clamps both move the wafer into a desired position on the blade and clamp the wafer in place during transport by the arms. The clamps are reciprocally mounted on the blade and are connected with and driven by a rotatable hub carried on the blade and rotated by the movement of the arms. Both the blade and the clamps include beveled surfaces that guide the wafer into place. The operation of the clamps is controlled by a laser that detects when the wafer is out of place or tilted on the blade.


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Hsiao, Yi-Li. (2003). Apparatus for clamping and transporting a semiconductor wafer (U.S. Patent No. 6543988). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6543988

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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